TY  - RPRT
TI  - Pyramiding panicle-level heat avoidance and grain-level heat tolerance improves rice grain appearance under high-temperature grain filling
AU  - Fukuda, H.
AU  - Sakamoto, T.
AU  - Yonemaru, J.-i.
AU  - Ogawa, D.
PY  - 2026
DO  - 10.64898/2026.08.20.745907
UR  - https://www.biorxiv.org/content/10.64898/2026.08.20.745907v1
ID  - 10.64898/2026.08.20.745907
ER  -