@misc{indiciae5882c81133be,
  title = {Robust hydrogel-integrated microsystems enabled by enhanced interfacial bonding strength},
  author = {Bae, S. and Kim, Y.-W. and Sun, J.-Y. and Kwon, S.},
  year = {2022},
  doi = {10.1101/2021.12.31.474677},
  url = {https://www.biorxiv.org/content/10.1101/2021.12.31.474677v1},
  note = {Source identifier: 10.1101/2021.12.31.474677}
}